John H. Lau (Lau, John H.)
Used books, rare books and new books
Ball Grid Array Technology
ISBN 9780070366084
Hardcover, McGraw-Hill Professional, 1994
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Chip Scale Package: Design, Materials, Process, Reliability, and Applications
ISBN 9780070383043
Hardcover, McGraw-Hill Professional, 1999
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Electronic Packaging: Design, Materials, Process, and Reliability
ISBN 9780070371354
Hardcover, McGraw-Hill Professional, 1998
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Flip Chip Technologies
ISBN 9780070366091
Hardcover, McGraw-Hill Professional, 1995
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Handbook of Fine Pitch Surface Mount Technology
ISBN 9780442012588
Hardcover, Springer, 1993
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Handbook Of Tape Automated Bonding
ISBN 9780442004279
Hardcover, Springer, 1992
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Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
ISBN 9780071351416
Hardcover, McGraw-Hill Professional, 2000
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Mechanics of Solder Alloy Interconnects (Electrical Engineering)
ISBN 9780442015053
Hardcover, Springer, 1993
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Microvias: For Low Cost, High Density Interconnects
ISBN 9780071363273
Hardcover, McGraw-Hill Professional, 2001
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