ISBN is

978-0-07-037715-8 / 0070377154

Multichip Module Design, Fabrication, and Testing (Electronic Packaging and Interconnection)

by Licari, James J.

Publisher:Mcgraw-Hill (Tx)

Edition:Hardcover

Language:English

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About the book:

The advent of multichip modules (MCMs) is revolutionizing the ways in which electronic systems and equipment are designed, tested and manufactured. This evolving technology for packaging printed circuit boards (PCBs) is commanding both interest and excitement. This work describes MCM technology, as well as showing designers how to use it in practice. The guide covers practical issues such as electrical testing, rework procedures and failure modes and mechanisms.

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