Way Kuo

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• 
  Optimal Reliability Design: Fundamentals and Applications
  

  by Ching-Lai Hwang, Frank A. Tillman, V. Rajendra Prasad, Way Kuo

  ISBN 0521781272 (0-521-78127-2)
  Hardcover, Cambridge Univ Pr

  
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  • Optimal Reliability Design: Fundamentals and Applications: ISBN 0521781272 (0-521-78127-2)
    Hardcover, Cambridge Univ Pr
• 
  Optimal Reliability Design : Fundamentals and Applications
  

  by Way Kuo , V. Rajendra Prasad, Frank A. Tillman, Ching-Lai Hwang

  ISBN 0521031915 (0-521-03191-5)
  Softcover, Cambridge University Press

  
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  • Optimal Reliability Design : Fundamentals and Applications: ISBN 0521031915 (0-521-03191-5)
    Softcover, Cambridge University Press
• 
  Optimal Reliability Modeling: Principles and Applications
  

  by Way Kuo , Ming J. Zuo

  ISBN 047127545X (0-471-27545-X)
  Hardcover, John Wiley & Sons

  
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  • Optimal Reliability Modeling: Principles and Applications: ISBN 047139761X (0-471-39761-X)
    Hardcover, John Wiley & Sons Inc
  • Optimal Reliability Modeling: Principles and Applications: ISBN 047127545X (0-471-27545-X)
    Hardcover, John Wiley & Sons
• 
  Optimization of Systems Reliability
  

  by Ching-Lai Hwang, Way Kuo , Frank A. Tillman

  ISBN 0824774469 (0-8247-7446-9)
  Hardcover, Marcel Dekker Inc

  
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  • Optimization of Systems Reliability: ISBN 0824774469 (0-8247-7446-9)
    Hardcover, Marcel Dekker Inc
• 
  Quality Through Engineering Design
  

  by Way Kuo , Marcia Martens Pierson

  ISBN 0444896678 (0-444-89667-8)
  Hardcover, Elsevier Science Ltd

  
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  • Quality Through Engineering Design: ISBN 0444896678 (0-444-89667-8)
    Hardcover, Elsevier Science Ltd
• 
  Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development
  

  by Taeho Kim, Way Kuo , Wei-Ting Kary Chien

  ISBN 0792381076 (0-7923-8107-6)
  Hardcover, Kluwer Academic Pub

  
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  More editions of Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development:

  • Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development: ISBN 0792381076 (0-7923-8107-6)
    Hardcover, Kluwer Academic Pub