Search
|
About
|
Preferences
|
Feedback
|
Help
Find any book at the best price.
Search Author, Title or ISBN
Go
Tien Y. Wu
(Wu, Tien Y.)
used books, rare books and new books
›
Find all books by 'Tien Y. Wu' and compare prices
›
Find signed collectible books by 'Tien Y. Wu'
Application of Fracture Mechanics in Electronic Packaging and Materials: Presented at the 1995 Asme International Mechanical Engineering Congress and ... Francisco, California (Eep (Series), V. 11.)
by International Mechanical Engineering Congress And Exposition (1996 : Atlanta, Ga.), Tien Y. Wu
, American Society Of Mechanical Engineers....
ISBN 9780791817360 (978-0-7918-1736-0)
Softcover, Amer Society of Mechanical, 1995
Find This Book
›
Find signed collectible books: 'Application of Fracture Mechanics in Electronic Packaging and Materials: Presented at the 1995 Asme International Mechanical Engineering Congress and ... Francisco, California (Eep (Series), V. 11.)'