A. Bar Cohen (A. Bar-Cohen / Cohen, A.Bar- / Cohen, A. Bar / Bar-Cohen, A.)

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  Advances in Electronic Packaging, 1995: Proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 Presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii

  ISBN 0791813037 (0-7918-1303-7)
  Hardcover, American Society of Mechanical Engineers

  
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  • Advances in Electronic Packaging, 1995: Proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 Presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii: ISBN 0791813037 (0-7918-1303-7)
    Hardcover, American Society of Mechanical Engineers
• 
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  Advances in Thermal Modeling of Electronic Components and Systems
  

  by Allan D. Kraus, A. Bar Cohen

  ISBN 0791800156 (0-7918-0015-6)
  Hardcover, Amer Society of Mechanical

  
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  Book summary:

  The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories [via]

  More editions of Advances in Thermal Modeling of Electronic Components and Systems:

  • Advances in Thermal Modeling of Electronic Components and Systems: ISBN 0791800156 (0-7918-0015-6)
    Hardcover, Amer Society of Mechanical
• 
  Advances in Thermal Modelling of Electronic Components and Systems
  

  by A. Bar Cohen

  ISBN 0791800652 (0-7918-0065-2)
  Hardcover, Amer Society of Mechanical

  
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  More editions of Advances in Thermal Modelling of Electronic Components and Systems:

  • Advances in Thermal Modelling of Electronic Components and Systems: ISBN 0791800652 (0-7918-0065-2)
    Hardcover, Amer Society of Mechanical
• 
  New Developments in Heat Exchangers
  

  by A. Bar Cohen

  ISBN 905699512X (90-5699-512-X)
  Hardcover, G & B Science Pub

  
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  • New Developments in Heat Exchangers: ISBN 905699512X (90-5699-512-X)
    Hardcover, G & B Science Pub